Technology Quality Service
SHINEON MCP1313 series is designed and tested for use in camera flash and lighting. It provides industry-leading intensity and
uniformity with the innovative CSP Flip-Chip Package technology. The highest performance allows it provides high brightness as one
kind of new LED light source for smartphone and LED lamps. SHINEON MCP1313 series will redefine performance and size in the
SHINEON provides a full range of CSPs for your specific application. Each application has it’s own set of packaging requirements that may vary from the smallest possible size, reliability, long-term footprint/size compatibility, unit cost, total cost, or ease of use. The CSP of choice will vary depending on which packaging requirements are most important to your application.
Peak forward current: 500mA
Junction Temperature: 140℃
Thermal Resistance: <4℃/W